70 μm fine pitch wirebonding

Author

Nguyen, L. ; Singh, I. ; Murray, C. ; Jackson, J. ; DeRosa, J. ; Ho, D.

Author_Institution

Nat. Semicond. Corp., Santa Clara, CA, USA

fYear

1998

fDate

19-21 Oct 1998

Firstpage

394

Lastpage

400

Abstract

As device feature dimensions get ever smaller, the industry trend is to shrink the die size for higher throughput and yield. Smaller pad size at finer pitch presents many difficulties and are unachievable with the current generation of bonders. This paper presents the highlights of a Sematech-funded effort to identify barriers to fine pitch wirebonding, and develop the necessary capabilities to achieve 70 μm in-line wirebonding on fine pitch leadframes. The program addressed the tooling, software, and hardware needed to enhance the performance of a wirebonder. The ESEC 3006 F/X wirebonder was selected for the case study. Feasibility was shown in a lab environment, and manufacturability was demonstrated under a high volume production environment

Keywords

fine-pitch technology; integrated circuit design; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; integrated circuit yield; lead bonding; 70 micron; ESEC 3006 F/X wirebonder; device feature dimensions; die size; fine pitch leadframes; fine pitch wirebonding; hardware; in-line wirebonding; manufacturability; pad size; process yield; software; throughput; tooling; volume production environment; wirebonder performance; Bonding; Consumer electronics; Costs; Electronic equipment manufacture; Flip chip; Hardware; Manufacturing; Packaging machines; Production; Shape; Software performance; Software tools; Throughput; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-4523-1

Type

conf

DOI

10.1109/IEMT.1998.731164

Filename

731164