DocumentCode
2354310
Title
Impact of ultra clean wafer processings on power devices
Author
Ohmi, Tadahiro
Author_Institution
Tohoku University
fYear
1990
fDate
1990
Firstpage
157
Lastpage
162
Keywords
Dark current; Fabrication; Fluctuations; Manufacturing processes; Plasma temperature; Process control; Semiconductor device manufacture; Surface cleaning; Surface contamination; Ultra large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs, 1990. ISPSD '90. Proceedings of the 2nd International Symposium on
ISSN
1063-6854
Type
conf
DOI
10.1109/ISPSD.1990.991077
Filename
991077
Link To Document