Electrical modeling of CBGA packages

Author

Beker, Benjamin ; Cokkinides, George ; Agrawal, Amit P.

Author_Institution

Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA

fYear

1995

fDate

21-24 May 1995

Firstpage

251

Lastpage

254

Abstract

This paper describes a quasi-static approach for electrical modeling of package parasitics associated with ceramic ball grid arrays (CBGAs). It is based on the finite difference solution to the Laplace equation in an inhomogeneous medium. Following the computation of the charge density and capacitance, a physical non-uniform current distribution on all conductors is determined for inductance and resistance calculations. Some typical, high I/O CBGA package designs are examined to determine worst-case parasitic R, L, and C parameters

Keywords

Laplace equations; capacitance; ceramics; current distribution; equivalent circuits; finite difference methods; inductance; integrated circuit modelling; integrated circuit packaging; Laplace equation; capacitance; ceramic ball grid arrays; charge density; electrical modeling; equivalent circuit parameters; finite difference solution; high I/O CBGA package designs; inductance calculation; inhomogeneous medium; package parasitics; physical nonuniform current distribution; quasi-static approach; resistance calculation; Ceramics; Conductors; Current distribution; Distributed computing; Electronics packaging; Finite difference methods; Inductance; Laplace equations; Parasitic capacitance; Physics computing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.514393

Filename

514393