Title :
Small warpage dielectrically isolated wafer for power ICs by silicon wafer direct-bonding
Author :
Furukawa, K. ; Nakagawa, A. ; Tanzawa, K. ; Kawamura, N.
Author_Institution :
Toshiba Corp.
Keywords :
Dielectric devices; Fabrication; Infrared imaging; Mirrors; Power integrated circuits; Silicon on insulator technology; Temperature; Very large scale integration; Voltage; Wafer bonding;
Conference_Titel :
Power Semiconductor Devices and ICs, 1990. ISPSD '90. Proceedings of the 2nd International Symposium on
DOI :
10.1109/ISPSD.1990.991081
