Title :
Cost analysis: solder bumped flip chip versus wire bonding
Author :
Lau, John ; Chen, Ray
Author_Institution :
Express Packaging Syst. Inc., Palo Alto, CA, USA
Abstract :
The cost of wire bonding chip and solder bumped flip chip on board or on organic substrate is studied. The effects of IC chip yields, gold and solder materials, and the major equipment of these technologies on costs are examined. Useful equations and charts for determining the cost of and comparing the cost between these technologies are provided
Keywords :
chip-on-board packaging; costing; flip-chip devices; integrated circuit bonding; integrated circuit packaging; integrated circuit yield; lead bonding; microassembling; soldering; Au; IC chip yields; chip wire bonding; cost analysis; cost comparison; cost determination; equipment costs; gold wires; organic substrate; solder bumped flip chip; solder bumped flip chip on board; solder materials; wire bonding; Bonding; Costs; Electronic equipment testing; Encapsulation; Equations; Flip chip; Gold; Integrated circuit interconnections; Packaging; Substrates; System testing; Wafer bonding; Wire;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-4523-1
DOI :
10.1109/IEMT.1998.731173
