• DocumentCode
    235443
  • Title

    Stretchable and transparent silicone/zinc oxide nanocomposite for advanced LED packaging

  • Author

    Xueying Zhao ; Liyi Li ; Zhuo Li ; Ching-Ping Wong

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    1745
  • Lastpage
    1749
  • Abstract
    For current light-emitting diode (LED) packaging technology, one of the key challenges is light extraction, due to the difference in index of refraction between LED chip and air. Silicone nanocomposites have been widely researched for applications in LED encapsulant to reduce the difference in refractive index. Silicone is desirable for LED encapsulant because of its optical transparency and photothermal resistance. However, less attention has been paid to the elastic properties of silicone which would enable a stretchable LED encapsulant. Hence the objective of this study is to examine the stretch ability of silicone/zinc oxide (ZnO) nanocomposites for LED packaging. Wurtzite ZnO nanoparticles were prepared in colloids and subjected to silane treatment. Effects of both ex situ and in situ silane treatment on the final mechanical and optical properties of the silicone/ZnO nanocomposites were examined. Silicone/ZnO nanocomposites exhibit significantly more compliant stress-strain behavior than silicone control; silicone/silane-treated ZnO nanocomposites, in particular, exhibit more serrated stress-strain curves. Silicone/silane-treated ZnO nanocomposites exhibit higher transmittance than silicone/unmodified ZnO nanocomposites, indicating improved dispersion of the nanoparticles. The silicone/5% silane-treated ZnO nanocomposite using in situ method is able to deform over a range of up to 160%; its film (~40 microns thick) exhibits transmittance >70% throughout the visible range.
  • Keywords
    II-VI semiconductors; elemental semiconductors; light emitting diodes; nanocomposites; nanoparticles; refractive index; semiconductor device packaging; silicon; zinc compounds; LED chip; Si-ZnO; advanced LED packaging; light extraction; light-emitting diode packaging technology; mechanical properties; nanocomposite; optical properties; optical transparency; photothermal resistance; refractive index; stress-strain curves; wurtzite nanoparticles; Films; Light emitting diodes; Nanoparticles; Polymers; Strain; Zinc oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
  • Conference_Location
    Orlando, FL
  • Type

    conf

  • DOI
    10.1109/ECTC.2014.6897533
  • Filename
    6897533