Title :
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)
Abstract :
The following topics are dealt with: RF/microwave techniques; system design and technology; power distribution design and noise; electromagnetic issues; transmission lines; measurements; on-chip issues and interconnection macromodeling.
Keywords :
electronics packaging; RF techniques; electrical performance; electromagnetic issues; electronic packaging; interconnection macromodeling; measurements; microwave techniques; noise; on-chip issues; power distribution design; system design; transmission lines;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1249986
