DocumentCode :
2354532
Title :
Architecting interconnect
Author :
Hofstee, H. Peter
Author_Institution :
IBM Microelectron. Div., Austin, TX, USA
fYear :
2003
fDate :
27-29 Oct. 2003
Firstpage :
3
Abstract :
Power is becoming the most significant limiter of processor performance, and increasing the ratio of logic versus cache transistors, as compared to the traditional roadmap, makes the situation worse. Also, the 5/spl times/ additional increase in I/O bandwidth requires significant extra power, putting a premium on signaling techniques that combine high per pin frequencies with low power per Gbit/s: However, limiting frequency improvements - to only 20% per year makes the situation better compared to historical growth rates and especially limits hot spot power densities. Nevertheless, the challenge to improve power efficiency, power delivery, and heat removal remains significant. Though mostly intended as a challenge to the EPEP community; my talk will also cover some of the advances made on addressing the main challenges and discusses some approaches to system and package design that may-help meet the challenges that remain.
Keywords :
cooling; electronics packaging; microprocessor chips; thermal management (packaging); I/O bandwidth; architecting interconnect; cooling; microarchitecture; microprocessors; package design; power delivery; processor performance; system design; Bandwidth; CMOS process; CMOS technology; Delay; Frequency; Integrated circuit interconnections; Microelectronics; Microprocessors; Pipeline processing; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
Type :
conf
DOI :
10.1109/EPEP.2003.1249987
Filename :
1249987
Link To Document :
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