Title :
Modeling and simulation of switching noise with the associated package resonance for high speed digital circuits
Author :
Jong, Jyh-Ming ; Tripathi, Vijai K. ; Janko, Bozidar
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
In this paper, a circuit modeling technique based on time domain measurements for power/ground systems in electronic packages is presented. Equivalent circuit model of power/ground systems for an MLC package is then incorporated with the circuit model of high speed digital drivers for switching noise simulation
Keywords :
digital integrated circuits; equivalent circuits; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; resonance; IC packages; MLC package; circuit modeling technique; digital drivers; electronic packages; equivalent circuit model; high speed digital circuits; package resonance; power/ground systems; switching noise simulation; time domain measurements; Circuit noise; Circuit simulation; Electronics packaging; Impedance; Power measurement; Power system modeling; Resonance; Semiconductor device modeling; Switching circuits; Time measurement;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.514403
