Title :
Simulation and modeling of mode conversion at vias in multilayer interconnections
Author :
Liaw, Haw-Jyh ; Merkelo, Henri
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
The process of signal flow at vias in multilayer interconnections is discussed as a general phenomenon involving partial conversion of signal-line waveguide mode energy into parallel-plate waveguide mode energy. This partial conversion of linearly propagating mode into a cylindrically propagating parallel-plate waveguide mode at vias is discussed and illustrated with the graphic results of a 3D, full-wave propagation analysis. Based on these observations, equivalent circuits of vias which incorporate the mode conversion phenomenon are proposed. The effectiveness of the proposed model is demonstrated as a comparison between the 3D, full-wave simulation and SPICE circuit simulation
Keywords :
SPICE; equivalent circuits; integrated circuit interconnections; waveguide theory; 3D full-wave simulation; SPICE circuit simulation; cylindrically propagating mode; equivalent circuits; linearly propagating mode; mode conversion; modeling; multilayer interconnections; parallel-plate waveguide mode; signal flow; signal-line waveguide mode; vias; Circuit simulation; Computational modeling; Equivalent circuits; Integrated circuit interconnections; Nonhomogeneous media; Power system interconnection; SPICE; Signal processing; Very large scale integration; Waveguide components;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.514408
