Simulation and modeling of mode conversion at vias in multilayer interconnections

Author

Liaw, Haw-Jyh ; Merkelo, Henri

Author_Institution

Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA

fYear

1995

fDate

21-24 May 1995

Firstpage

361

Lastpage

367

Abstract

The process of signal flow at vias in multilayer interconnections is discussed as a general phenomenon involving partial conversion of signal-line waveguide mode energy into parallel-plate waveguide mode energy. This partial conversion of linearly propagating mode into a cylindrically propagating parallel-plate waveguide mode at vias is discussed and illustrated with the graphic results of a 3D, full-wave propagation analysis. Based on these observations, equivalent circuits of vias which incorporate the mode conversion phenomenon are proposed. The effectiveness of the proposed model is demonstrated as a comparison between the 3D, full-wave simulation and SPICE circuit simulation

Keywords

SPICE; equivalent circuits; integrated circuit interconnections; waveguide theory; 3D full-wave simulation; SPICE circuit simulation; cylindrically propagating mode; equivalent circuits; linearly propagating mode; mode conversion; modeling; multilayer interconnections; parallel-plate waveguide mode; signal flow; signal-line waveguide mode; vias; Circuit simulation; Computational modeling; Equivalent circuits; Integrated circuit interconnections; Nonhomogeneous media; Power system interconnection; SPICE; Signal processing; Very large scale integration; Waveguide components;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.514408

Filename

514408