DocumentCode :
2354695
Title :
Distributed on-chip power grid modeling: an electromagnetic alternative to RLC extraction-based models
Author :
Ihm, Jae-Yong ; Cangellaris, Andreas C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
fYear :
2003
fDate :
27-29 Oct. 2003
Firstpage :
37
Lastpage :
40
Abstract :
A methodology is presented for on-chip power grid modeling with uncompromised electromagnetic accuracy. The proposed methodology avoids the painstaking and error-prone process of power grid inductance extraction. Furthermore, the model is developed directly from the differential form of Maxwell´s equations, and thus avoids the dense-matrix issues that arise when PEEC-based electromagnetic models are utilized. Finally, it has the unique attribute that, in addition to providing for on-chip power switching modeling with electromagnetic accuracy it enables the direct modeling of distributed power-grid induced electromagnetic interference.
Keywords :
Maxwell equations; circuit simulation; computational electromagnetics; electromagnetic interference; electronic design automation; integrated circuit modelling; power supply circuits; computational flexibility; differential Maxwell´s equations; distributed modeling; electromagnetic accuracy; electromagnetic interference; on-chip power grid modeling; on-chip power switching modeling; package parasitics; power supply network; Electromagnetic fields; Electromagnetic modeling; Inductance; Integral equations; Integrated circuit interconnections; Maxwell equations; Packaging; Power grids; Power supplies; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
Type :
conf
DOI :
10.1109/EPEP.2003.1249995
Filename :
1249995
Link To Document :
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