Title :
Design and implementation of a 5GHz RF receiver front-end in LCP based system-on-package module with embedded chip technology
Author :
Duo, Xinzhong ; Zheng, Li-Rong ; Tenhunen, Hannu ; Chen, Liu ; Zou, Gang ; Liu, Johan
Author_Institution :
Lab. of Electron. & Comput. Syst., R. Inst. of Technol., Stockholm, Sweden
Abstract :
In this paper, we present a receiver front-end for 5GHz wireless LAN in novel LCP (liquid crystal polymer) based system-on-package module. The module is based on embedded chip technologies for system-on-package, which eliminates the constraints of off-chip pad drive capability and hence improves electrical performance. Furthermore, the novel LCP material shows excellent RF and microwave performance. The quality factors of key passive components such as inductors integrated in LCP substrate with thin film technologies is as high as 60. The insertion loss of the bandpass filter is 3dB. The conversion gain of the receiver front-end is 20dB and occupies 8.7mm by 3.6mm area.
Keywords :
Q-factor; chip scale packaging; liquid crystal polymers; microwave receivers; modules; 5 GHz; RF performance; RF receiver front-end; bandpass filters; conversion gain; downconverter; embedded chip technologies; front-end module; insertion loss; liquid crystal polymer based system-on-package; low noise amplifier; microwave performance; passive components; quality factors; wireless LAN; Chemical technology; Copper; Crystalline materials; Dielectric substrates; Electronic packaging thermal management; Integrated circuit interconnections; Integrated circuit technology; Liquid crystal polymers; Radio frequency; Thin film inductors;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1249998
