Title :
A broadband CPW-to-microstrip via-less transition for on wafer package probing applications
Author :
Zhu, Lin ; Melde, Kathleen L. ; Prince, John L.
Author_Institution :
Electr. & Comput. Eng. Dept., Arizona Univ., Tucson, AZ, USA
Abstract :
A broadband CPW to microstrip via-less transition is proposed and the optimal design is discussed. Simulation and measurement results are given. The results of the transition as multiline TRL calibration standards are presented.
Keywords :
coplanar waveguides; electronics packaging; impedance matching; microstrip transitions; microwave measurement; probes; broadband CPW to microstrip via-less transition; coplanar waveguide with ground; gradually increased slot width; impedance matching; multiline TRL calibration standards; on wafer package probing; optimal design; tapered bottom ground plane; Application software; Bandwidth; Coplanar waveguides; Dielectric measurements; Electromagnetic waveguides; Microstrip; Packaging; Probes; Solids; Transmission line measurements;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250003
