DocumentCode
2354882
Title
Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements
Author
Pfeiffer, Ullrich ; Chandrasekhar, Arun
Author_Institution
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2003
fDate
27-29 Oct. 2003
Firstpage
79
Lastpage
82
Abstract
We have shown the variation of the RF performance of the QFN package in accordance with its high volume manufacturing and assembly process. We have also developed a distributed model for the chip-to-package interconnect.
Keywords
S-parameters; chip-on-board packaging; interconnections; microwave reflectometry; modelling; statistical analysis; RF performance; S-parameter; chip-to-package interconnect; distributed model; high volume assembly; low-cost leadless packages; nondestructive measurements; quad flat no-lead package; reflection coefficients; statistical analysis; Assembly; Chip scale packaging; Electronics packaging; Production; Radio frequency; Scattering parameters; Semiconductor device measurement; Statistical analysis; System performance; Volume measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2003
Conference_Location
Princeton, NJ, USA
Print_ISBN
0-7803-8128-9
Type
conf
DOI
10.1109/EPEP.2003.1250004
Filename
1250004
Link To Document