Title :
Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements
Author :
Pfeiffer, Ullrich ; Chandrasekhar, Arun
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
We have shown the variation of the RF performance of the QFN package in accordance with its high volume manufacturing and assembly process. We have also developed a distributed model for the chip-to-package interconnect.
Keywords :
S-parameters; chip-on-board packaging; interconnections; microwave reflectometry; modelling; statistical analysis; RF performance; S-parameter; chip-to-package interconnect; distributed model; high volume assembly; low-cost leadless packages; nondestructive measurements; quad flat no-lead package; reflection coefficients; statistical analysis; Assembly; Chip scale packaging; Electronics packaging; Production; Radio frequency; Scattering parameters; Semiconductor device measurement; Statistical analysis; System performance; Volume measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250004
