Design and analysis of embedded inductor on low cost multilayer laminate MCM technology

Author

Lee, Ryan C. ; Gye-An Lee ; Megahed, Mohamed

Author_Institution

Skyworks Solutions Inc., Irvine, CA, USA

fYear

2003

fDate

27-29 Oct. 2003

Firstpage

83

Lastpage

86

Abstract

The embedded inductor is designed and analyzed on low cost MCM laminate substrate based on RF measurement. Single layer and multilayer inductance library are developed on 4-layer MCM laminate substrate with 50/200/50 dielectric stack-up. Characterization process and modeling method are presented and analytical equations are provided. Process variation effect on inductor is also studied to identify the range of inductance variation according to the physical parameters of the embedded inductor. Area analysis is conducted for each configuration and single layer inductor is recommended for less than 8 nH inductance and two-layer inductor is recommended for more than 8 nH inductance.

Keywords

inductance; inductors; multichip modules; RF measurement; dielectric stack-up; embedded inductor; inductance variation; low cost substrate; multilayer laminate MCM; process variation effect; two-layer inductor; Costs; Dielectric measurements; Dielectric substrates; Equations; Inductance; Inductors; Laminates; Libraries; Nonhomogeneous media; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2003

Conference_Location

Princeton, NJ, USA

Print_ISBN

0-7803-8128-9

Type

conf

DOI

10.1109/EPEP.2003.1250005

Filename

1250005