Title :
Experimental characterization of copper/low-k transmission line interconnects through microwave measurements
Author :
Kim, Jooyong ; Neikirk, D.P.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Abstract :
In this paper, we present the results of microwave measurements of copper/low-k transmission line interconnects. From measured S-parameters, the extracted R, L, and C for copper/low-k transmission lines are presented. In addition, the relative dielectric constant and loss tangent for various dielectric materials (SiO/sub 2/, low-k2 (Novellus Coral low-k dielectric), and low-k1 (JSR Corp. low-k dielectric)) up to 40 GHz are given.
Keywords :
S-parameters; copper; dielectric loss measurement; integrated circuit interconnections; integrated circuit measurement; microwave measurement; permittivity measurement; silicon compounds; 500 MHz to 40 GHz; S-parameter measurements; SiO/sub 2/; copper/low-k transmission line interconnects; dielectric loss tangent; low-k dielectric materials; microwave measurements; relative dielectric constant; Circuit testing; Copper; Dielectric constant; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Dielectric thin films; Microwave measurements; Scattering parameters; Transmission line measurements;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250007
