Title :
Dispersion and resonance of on-chip interconnect lines with underlayer orthogonal metal grids
Author :
Wang, Pingshan ; Kan, Edwin C.
Author_Institution :
Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
Abstract :
High-speed interconnect lines with underlayer orthogonal metal grids show significant decreases in dispersions and signal transmission velocities below /spl sim/10 GHz. Strong resonance occurs at higher frequencies, which can be accurately predicated by the rectangular patch antenna theory.
Keywords :
antenna theory; circuit resonance; dispersion (wave); integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; 10 GHz; high-speed interconnect lines; interconnect dispersion; interconnect resonance; on-chip interconnect lines; rectangular patch antenna theory; signal transmission velocity; underlayer orthogonal metal grids; Circuit testing; Frequency dependence; Grid computing; Integrated circuit interconnections; Microstrip; Patch antennas; Resonance; Routing; Signal design; Very large scale integration;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250011
