Impact and modeling of anti-pad array on power delivery system

Author

Yang, Zhiping ; Zhao, Jin ; Camerlo, Sergio ; Fang, Jiayuan

Author_Institution

Cisco Syst., Inc., San Jose, CA, USA

fYear

2003

fDate

27-29 Oct. 2003

Firstpage

117

Lastpage

120

Abstract

The impact of anti-pad array on power and ground planes,. especially at the area right under the BGA package, has been studied in this paper. An effective modeling and simulation approach based on 3D field computation has been used to take into account the anti-pad array effect. The simulation results match the measurement results. It has been found that the effect of anti-pad array on power delivery system is considerable; therefore it cannot be ignored in the power delivery system analysis and design for high-speed applications.

Keywords

S-parameters; SPICE; ball grid arrays; chip-on-board packaging; circuit simulation; equivalent circuits; multichip modules; 3D field computation; ASIC package; BGA package; SPICE; anti-pad array; equivalent parameters; ground planes; high-speed applications; modeling approach; power delivery system; signal integrity software; simulation approach; two-port S-parameter; Capacitance; Computational modeling; Frequency; Hardware; Inductance; Integrated circuit modeling; Internet; Packaging; Power system modeling; Power transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2003

Conference_Location

Princeton, NJ, USA

Print_ISBN

0-7803-8128-9

Type

conf

DOI

10.1109/EPEP.2003.1250012

Filename

1250012