Title :
Impact of high impedance mid-frequency noise on power delivery
Author :
Tsai, Hsiao-Ping
Author_Institution :
Mindspeed Technol., Newport Beach, CA, USA
Abstract :
In this paper, we present the core switching noise analysis of the power distribution system (PDS) for a signal processor on a card. The SPEED2000, a SPICE and full-wave based simulation tool is used to study the frequency and transient responses of the core switching noise. The correlation between the result in frequency domain and time domain is discussed in detail. The frequency responses of the on-chip switching current and package current are introduced to illustrate that the noise level caused by the high impedance of the PDS is also frequency dependent.
Keywords :
SPICE; ball grid arrays; computer power supplies; finite difference time-domain analysis; frequency response; integrated circuit noise; integrated circuit packaging; power supply circuits; switching; transient response; BGA package; SPEED2000; SPICE; core switching noise analysis; finite difference time domain method; frequency responses; full-wave based simulation; on-chip switching current; package current; power distribution system; signal processor; transient responses; voltage regulator module; Capacitors; Finite difference methods; Frequency domain analysis; Impedance; Noise level; Packaging; Power distribution; Pulse measurements; Signal analysis; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250014
