Impact of high impedance mid-frequency noise on power delivery

Author

Tsai, Hsiao-Ping

Author_Institution

Mindspeed Technol., Newport Beach, CA, USA

fYear

2003

fDate

27-29 Oct. 2003

Firstpage

125

Lastpage

128

Abstract

In this paper, we present the core switching noise analysis of the power distribution system (PDS) for a signal processor on a card. The SPEED2000, a SPICE and full-wave based simulation tool is used to study the frequency and transient responses of the core switching noise. The correlation between the result in frequency domain and time domain is discussed in detail. The frequency responses of the on-chip switching current and package current are introduced to illustrate that the noise level caused by the high impedance of the PDS is also frequency dependent.

Keywords

SPICE; ball grid arrays; computer power supplies; finite difference time-domain analysis; frequency response; integrated circuit noise; integrated circuit packaging; power supply circuits; switching; transient response; BGA package; SPEED2000; SPICE; core switching noise analysis; finite difference time domain method; frequency responses; full-wave based simulation; on-chip switching current; package current; power distribution system; signal processor; transient responses; voltage regulator module; Capacitors; Finite difference methods; Frequency domain analysis; Impedance; Noise level; Packaging; Power distribution; Pulse measurements; Signal analysis; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2003

Conference_Location

Princeton, NJ, USA

Print_ISBN

0-7803-8128-9

Type

conf

DOI

10.1109/EPEP.2003.1250014

Filename

1250014