Title :
Significant reduction of power/ground inductive impedance and simultaneous switching noise by using embedded film capacitor
Author :
Kim, Hyungsoo ; Jeong, Youchul ; Park, Jongbae ; Lee, SeokKy ; JongKuk-Hong ; Hong, Youngsoo ; Kim, Joungho
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejon, South Korea
Abstract :
Significant reduction of power/ground inductive impedance and SSN suppression was successfully demonstrated by using embedded capacitor film in high performance package and PCB up to 3GHz frequency range. The reduction of the inductance impedance and SSN are acquired by the help of reduced via inductance in the embedded film capacitor.
Keywords :
chip-on-board packaging; electric impedance; frequency-domain analysis; inductance; integrated circuit noise; power supply circuits; printed circuits; thin film capacitors; time-domain analysis; PCB; discrete decoupling capacitor; embedded capacitor film; frequency domain measurement; high performance package; power-ground inductive impedance; reduced via inductance; simultaneous switching noise; time domain measurement; Capacitors; Clocks; Frequency; Impedance measurement; Inductance; Noise measurement; Noise reduction; Packaging; Power measurement; Size measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250015
