DocumentCode
235515
Title
Contents
fYear
2014
fDate
19-21 Nov. 2014
Firstpage
1
Lastpage
8
Abstract
The following topics are dealt with: NAND flash memory; planarization-CMP technology; TSV; 3D-IC; slurry and cleaning; green device; and pad & dresser.
Keywords
NAND circuits; chemical mechanical polishing; cleaning; flash memories; planarisation; slurries; three-dimensional integrated circuits; 3D-IC; NAND flash memory; TSV; cleaning; dresser; green device; pad; planarization-CMP technology; slurry;
fLanguage
English
Publisher
ieee
Conference_Titel
Planarization/CMP Technology (ICPT), 2014 International Conference on
Conference_Location
Kobe
Print_ISBN
978-1-4799-5556-5
Type
conf
DOI
10.1109/ICPT.2014.7017228
Filename
7017228
Link To Document