Abstract :
The following topics are dealt with: NAND flash memory; planarization-CMP technology; TSV; 3D-IC; slurry and cleaning; green device; and pad & dresser.
Keywords :
NAND circuits; chemical mechanical polishing; cleaning; flash memories; planarisation; slurries; three-dimensional integrated circuits; 3D-IC; NAND flash memory; TSV; cleaning; dresser; green device; pad; planarization-CMP technology; slurry;
Conference_Titel :
Planarization/CMP Technology (ICPT), 2014 International Conference on
Conference_Location :
Kobe
Print_ISBN :
978-1-4799-5556-5
DOI :
10.1109/ICPT.2014.7017228
