Title :
Compensation of ESD and input capacitance effect by using package bondwire inductance for over Gbps differential SerDes devices
Author :
Ahn, Seungyoung ; Park, Jongbae ; Chung, Daehyun ; Kim, Joungho
Author_Institution :
Terahertz Interconnection & Package Lab., Korea Adv. Inst. of Sci. & Technol., South Korea
Abstract :
We firstly introduce the compensation of ICs input capacitance effect by using the package bondwire inductance. With the analysis of this effect, we suggested the methodology of finding optimized inductance and demonstrated the improvement in time-domain performance by simulation and measurement.
Keywords :
ball grid arrays; compensation; electrostatic discharge; inductance; integrated circuit packaging; lead bonding; transceivers; BGA package; IC chip; differential SerDes devices; electrostatic discharge compensation; equivalent circuit model; eye-diagram; input capacitance effect; insertion loss; optimized inductance; package bondwire inductance; protection circuit; return loss; time-domain performance; Bonding; Capacitance; Circuits; Electrostatic discharge; Equations; Frequency; Impedance; Inductance; Insertion loss; Packaging;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250022
