• DocumentCode
    235524
  • Title

    New era of power electronics by SiC power devices evolution

  • Author

    Ino, Kazuhide

  • Author_Institution
    ROHM Co., Ltd., Kyoto, Japan
  • fYear
    2014
  • fDate
    19-21 Nov. 2014
  • Firstpage
    4
  • Lastpage
    4
  • Abstract
    Silicon carbide (SiC) power devices offer significant advantages for power electronics such as improved efficiency, reduced size and weight of electric systems. Such benefits are realized by its superior material properties of higher electric field breakdown and higher thermal conductivity compared to silicon and recent technological improvements in SiC substrate quality and device performance. By using wide bandgap semiconductor such as SiC, the unipolar devices are available in the power device application area over 600V while silicon requires the bipolar devices such as pn junction or IGBT. The unipolar devices of Schottky barrier diodes (SBDs) and MOSFETs realize the fast switching and resulting lower switching losses due to quite less stored charges. Mass production of SiC-MOSFET and Full SiC Power Module has finally started in 2010 and 2012, respectively. New era of power electronics has been just opened by SiC power devices.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Planarization/CMP Technology (ICPT), 2014 International Conference on
  • Conference_Location
    Kobe, Japan
  • Print_ISBN
    978-1-4799-5556-5
  • Type

    conf

  • DOI
    10.1109/ICPT.2014.7017231
  • Filename
    7017231