DocumentCode
2355274
Title
Reduction in radiated emission using CSP with built-in decoupling components
Author
Nakano, Ken ; Sudo, Toshio ; Haga, Satom
Author_Institution
Assoc. of Super-Adv. Electron. Technol. (ASET), Tsukuba, Japan
fYear
2003
fDate
27-29 Oct. 2003
Firstpage
195
Lastpage
198
Abstract
Reducing radiated emission by using a chip size package with built-in decoupling components is verified experimentally. By adopting built-in decoupling components, based on the current fluctuation by the simple equivalent circuit model, valid reduction in radiated emission is recognized.
Keywords
chip scale packaging; electromagnetic interference; equivalent circuits; integrated circuit design; integrated circuit measurement; integrated circuit modelling; CSP radiated emission reduction; built-in decoupling components; chip size package; current fluctuation; equivalent circuit model; Chip scale packaging; Circuit testing; Clocks; Electromagnetic radiation; Electronics packaging; Equivalent circuits; Fluctuations; Large scale integration; Logic circuits; Power supplies;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2003
Conference_Location
Princeton, NJ, USA
Print_ISBN
0-7803-8128-9
Type
conf
DOI
10.1109/EPEP.2003.1250030
Filename
1250030
Link To Document