• DocumentCode
    2355400
  • Title

    Applications of closed-form wiring escape formulae to a high performance printed wiring board

  • Author

    Zhou, Tingdong ; Katopis, George A.

  • Author_Institution
    IBM Corp., Poughkeepsie, NY, USA
  • fYear
    2003
  • fDate
    27-29 Oct. 2003
  • Firstpage
    225
  • Lastpage
    228
  • Abstract
    Closed-form formulae are derived for wiring escape from an area array to the standard horizontal ground rules of the package level under consideration. The required layer counts for successful escape based on two strategies are given in this paper. The effects of lines per channel, extra channels at the edges of an area array, different via technologies, and signal pin depopulation are considered in the derivations. The resulting closed-form formulae are also used to a high performance printed wiring board for the estimation of the layers needed. The estimation of the layer count from our formulae agrees with the one achieved empirically in the actual design.
  • Keywords
    electronics packaging; multichip modules; printed circuit layout; MCM; area array; area array packaging; closed-form wiring escape formulae; extra channels; high performance printed wiring board; lines per channel; signal pin depopulation; standard horizontal ground rules; via technologies; Bandwidth; Cost function; Integrated circuit interconnections; Manufacturing; Packaging; Pins; Routing; Wire; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2003
  • Conference_Location
    Princeton, NJ, USA
  • Print_ISBN
    0-7803-8128-9
  • Type

    conf

  • DOI
    10.1109/EPEP.2003.1250037
  • Filename
    1250037