• DocumentCode
    2355423
  • Title

    Design and modeling challenges for DDR II memory subsystems

  • Author

    Wirick, A. ; Ulrich, S. ; Pham, N. ; Cases, M. ; de Araujo, D.N.

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA
  • fYear
    2003
  • fDate
    27-29 Oct. 2003
  • Firstpage
    229
  • Lastpage
    232
  • Abstract
    This paper describes the electrical packaging challenges, design issues, and design solutions for source-synchronous DDR II memory subsystems utilizing the double data rate (DDR) timing protocols. Major design and modeling issues are discussed, such as crosstalk, delay skew, impedance control and inter-symbol interference. The timing and jitter budgets, and the noise margin allocation for the various components of the optimization equations are discussed in conjunction with their associated design control techniques. A novel termination technique is discussed that allows for maximum memory capacity per channel at a given data rate.
  • Keywords
    circuit noise; circuit optimisation; crosstalk; intersymbol interference; jitter; memory cards; printed circuit design; system buses; timing; DDR II memory interface; DDR II memory subsystems; crosstalk; delay skew; double data rate timing protocols; electrical packaging; impedance control; inter-symbol interference; jitter budget; maximum channel memory capacity; noise margin allocation; optimization equations; source-synchronous memory subsystems; termination techniques; timing budget; Channel capacity; Crosstalk; Delay; Design optimization; Equations; Impedance; Interference; Packaging; Protocols; Timing jitter;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2003
  • Conference_Location
    Princeton, NJ, USA
  • Print_ISBN
    0-7803-8128-9
  • Type

    conf

  • DOI
    10.1109/EPEP.2003.1250038
  • Filename
    1250038