• DocumentCode
    2355521
  • Title

    BestFit: a SPICE-compatible model for efficient, passive, broadband transmission-line analysis of dispersive interconnects

  • Author

    Woo, Anne ; Yioultsis, Traianos ; Cangellaris, Andreas C.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • fYear
    2003
  • fDate
    27-29 Oct. 2003
  • Firstpage
    255
  • Lastpage
    258
  • Abstract
    "BestFit" refers to a mathematical methodology used for the direct passive synthesis of SPICE-compatible models of multi-conductor interconnect structures. Given the bandwidth of simulation, the length of the interconnect system, and its per-unit-length, frequency-dependent resistance, inductance, capacitance and conductance matrices, the proposed algorithm synthesizes a compact, multi-port, dispersive, SPICE-compatible model for the interconnect. The resulting model is in terms of a concatenation of a number of non-uniform segments of lumped passive circuit representations of the per-unit-length series impedance and shunt admittance matrices, the lengths of which are obtained as a result of a Pade-Chebyshev approximation of the frequency-dependent input impedance matrix of the multiconductor transmission line system. The synthesized circuit is "optimal" in the sense that highly-accurate responses can be obtained with a number of segments per minimum wavelength barely exceeding the Nyquist limit of 2.
  • Keywords
    Chebyshev approximation; SPICE; electric admittance; impedance matrix; interconnections; lumped parameter networks; multiconductor transmission lines; transmission line matrix methods; BestFit mathematical methodology; Pade-Chebyshev approximation; SPICE-compatible models; compact multiport dispersive model; direct passive synthesis; discrete model; exponential convergence; lumped passive circuit representations; multiconductor interconnect structures; multiconductor transmission line system; segments concatenation; series impedance matrices; shunt admittance matrices; Bandwidth; Circuit simulation; Circuit synthesis; Dispersion; Frequency synthesizers; Impedance; Integrated circuit interconnections; Mathematical model; Transmission line matrix methods; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2003
  • Conference_Location
    Princeton, NJ, USA
  • Print_ISBN
    0-7803-8128-9
  • Type

    conf

  • DOI
    10.1109/EPEP.2003.1250044
  • Filename
    1250044