• DocumentCode
    2355832
  • Title

    Toward a more robust and accurate fast integral equation solver for microchip applications

  • Author

    Chew, W.C. ; Jiang, L.J. ; Chu, Y.H. ; Wang, G.L. ; Pan, Y.C.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • fYear
    2003
  • fDate
    27-29 Oct. 2003
  • Firstpage
    333
  • Abstract
    Summary form only given. In this talk, we review fast integral equation solvers for low frequencies and high frequencies. We discuss some of the current problems and suggest possible solutions. We also describe the use of fast solvers for layered media. When applied to low frequencies, fast solvers usually have a low-frequency breakdown. Methods to overcome this low frequency breakdown are discussed. Moreover, a general method of moments encounters low frequency breakdown problems, and a remedy for this is also given. Many of the low frequency problems can be tackled by setting the frequency identically to zero, hence solving an electrostatic or a magnetostatic problem. Such a solution technique is also presented. For layered structures, we need a special Green´s function. A closed form Green´s function can be used to solve some of the complicated layered medium problems. Also, some applications of fast solvers to solve the lithography problem are demonstrated.
  • Keywords
    Green´s function methods; inhomogeneous media; integral equations; integrated circuit modelling; method of moments; Green´s function; electrostatic problems; fast integral equation solver; layered media; lithography problem; magnetostatic problems; method of moments; microchip modeling; solver low frequency breakdown; Electric breakdown; Electrostatics; Frequency; Green´s function methods; Integral equations; Lithography; Magnetostatics; Moment methods; Nonhomogeneous media; Robustness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2003
  • Conference_Location
    Princeton, NJ, USA
  • Print_ISBN
    0-7803-8128-9
  • Type

    conf

  • DOI
    10.1109/EPEP.2003.1250062
  • Filename
    1250062