DocumentCode
2355885
Title
A surface integral equation method for solving complicated electrically small structures
Author
Chu, Yunhui ; Chew, Weng Cho
Author_Institution
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
fYear
2003
fDate
27-29 Oct. 2003
Firstpage
341
Lastpage
344
Abstract
A surface integral equation (SIE) method based on contact-region modeling is applied for complicated electrically small structures in packaging and interconnect analysis. LF-MLFMA is employed to solve the matrix equation with O(N) computational cost.
Keywords
circuit analysis computing; electric field integral equations; electronics packaging; impedance matrix; matrix multiplication; complicated electrically small structures; computational cost; contact-region modeling; dielectric substrate; ground plane; impedance matrix; interconnect analysis; loop-tree basis; low-frequency multilevel fast multipole algorithm; matrix equation; matrix-vector multiplication; packaging analysis; strip inductor; surface integral equation method; three-region problem; Acceleration; Contacts; Costs; Dielectrics; Electric breakdown; Geometry; Integral equations; MLFMA; Packaging; Surface waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2003
Conference_Location
Princeton, NJ, USA
Print_ISBN
0-7803-8128-9
Type
conf
DOI
10.1109/EPEP.2003.1250064
Filename
1250064
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