DocumentCode
2355980
Title
Efficient full-wave analysis of packaging interconnects with bends using the method of moments
Author
Zhu, Zhaohui ; Dvorak, Steven L. ; Prince, John L.
Author_Institution
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
fYear
2003
fDate
27-29 Oct. 2003
Firstpage
363
Lastpage
366
Abstract
In this paper, a method of moments (MoM) based, full-wave layered interconnect simulator, UA-FWLIS is extended to handle interconnects with bends. The accuracy of this new bend-cell expansion function is investigated by comparing with Agilent Momentum.
Keywords
electronics packaging; interconnections; method of moments; network analysis; MoM; UA-FWLIS; bend-cell expansion function; full-wave analysis; full-wave layered interconnect simulator; packaging interconnect bends; Computational modeling; Fourier transforms; Integral equations; Integrated circuit interconnections; Message-oriented middleware; Moment methods; Packaging; Stripline; Testing; Transmission line matrix methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2003
Conference_Location
Princeton, NJ, USA
Print_ISBN
0-7803-8128-9
Type
conf
DOI
10.1109/EPEP.2003.1250069
Filename
1250069
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