Title :
Efficient full-wave analysis of packaging interconnects with bends using the method of moments
Author :
Zhu, Zhaohui ; Dvorak, Steven L. ; Prince, John L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Abstract :
In this paper, a method of moments (MoM) based, full-wave layered interconnect simulator, UA-FWLIS is extended to handle interconnects with bends. The accuracy of this new bend-cell expansion function is investigated by comparing with Agilent Momentum.
Keywords :
electronics packaging; interconnections; method of moments; network analysis; MoM; UA-FWLIS; bend-cell expansion function; full-wave analysis; full-wave layered interconnect simulator; packaging interconnect bends; Computational modeling; Fourier transforms; Integral equations; Integrated circuit interconnections; Message-oriented middleware; Moment methods; Packaging; Stripline; Testing; Transmission line matrix methods;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250069
