DocumentCode :
2356090
Title :
Comparison of film capacitor designs for a high power density application
Author :
Ennis, J.B. ; Rauch, J. ; Yang, X.H. ; Atkins, J.
Author_Institution :
Gen. Atomics Electron. Syst., Inc., San Diego, CA, USA
fYear :
2010
fDate :
23-27 May 2010
Firstpage :
225
Lastpage :
228
Abstract :
Three designs for an 8μF 3.1kV snubber capacitor were built and tested to compare the performance of different technologies for a high RMS current requirement. The designs were (1) extended foil , (2) metalized film, and (3) a hybrid containing both a metalized electrode and extended foil electrodes. All were impregnated with a vegetable oil and epoxy encapsulated in the same size case. The prototype of the hybrid design was only a 6μF capacitor due to machine limitations on winding dimensions that have since been resolved. A short-term, stepped-voltage test was performed on samples of each design until the units failed or to a maximum of 8.0kV, more than 2.5 times the rated voltage. Short-circuit discharge, AC partial discharge measurements, and AC stepped-stress tests were also performed and will be reported. The implications of these test data for the selection of specific capacitor technologies for power electronics applications will be discussed.
Keywords :
electrodes; partial discharge measurement; power capacitors; power electronics; snubbers; vegetable oils; AC partial discharge measurements; AC stepped-stress tests; capacitance 6 muF; capacitance 8 muF; extended foil electrodes; film capacitor designs; high power density application; metalized electrode; metalized film; power electronics applications; short-circuit discharge; snubber capacitor; stepped-voltage test; vegetable oil; voltage 3.1 kV; voltage 8.0 kV; Capacitance; Capacitors; Current measurement; Films; Temperature measurement; Voltage measurement; Windings; RMS current; capacitor; extended foil; metalized film; self-healing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Modulator and High Voltage Conference (IPMHVC), 2010 IEEE International
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-7131-7
Type :
conf
DOI :
10.1109/IPMHVC.2010.5958334
Filename :
5958334
Link To Document :
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