DocumentCode
2356256
Title
The effect of thermal capacitance and phase change on outside plant enclosures
Author
Estes, R.C.
Author_Institution
Bellcore, Morristown, NJ, USA
fYear
1991
fDate
12-14 Feb 1991
Firstpage
91
Lastpage
96
Abstract
The use of heat storage materials in outside plant (OSP) enclosures to reduce internal temperatures is examined. A simple thermal analog model is used to represent the heat flow in an enclosure that contains a thin envelope of phase change material (PCM). From this model, two sets of equations are developed for the internal and the PCM temperatures. The first set defines temperatures when the PCM is in a sensible-heat-storage mode, in which it acts as a simple thermal capacitor, and the second set defines temperatures when the PCM is in its latent-heat-storage mode. Exact solutions are obtained for both modes when the daily outside temperature and solar load are modeled by sinusoidal functions
Keywords
heat transfer; packaging; specific heat; temperature distribution; damping factor; delay factor; electronic equipment enclosure; heat flow; heat storage materials; internal temperature; latent-heat-storage mode; outside plant enclosures; phase change material; sensible-heat-storage mode; sinusoidal functions; solar load; thermal analog model; thermal capacitance; Capacitance; Delay estimation; Equations; Hazards; Material storage; Optical network units; Phase change materials; Protection; Telephony; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 1991. SEMI-THERM VII. Proceedings., Seventh Annual IEEE
Conference_Location
Phoenix, AZ
Print_ISBN
0-87942-664-0
Type
conf
DOI
10.1109/STHERM.1991.152919
Filename
152919
Link To Document