• DocumentCode
    2356256
  • Title

    The effect of thermal capacitance and phase change on outside plant enclosures

  • Author

    Estes, R.C.

  • Author_Institution
    Bellcore, Morristown, NJ, USA
  • fYear
    1991
  • fDate
    12-14 Feb 1991
  • Firstpage
    91
  • Lastpage
    96
  • Abstract
    The use of heat storage materials in outside plant (OSP) enclosures to reduce internal temperatures is examined. A simple thermal analog model is used to represent the heat flow in an enclosure that contains a thin envelope of phase change material (PCM). From this model, two sets of equations are developed for the internal and the PCM temperatures. The first set defines temperatures when the PCM is in a sensible-heat-storage mode, in which it acts as a simple thermal capacitor, and the second set defines temperatures when the PCM is in its latent-heat-storage mode. Exact solutions are obtained for both modes when the daily outside temperature and solar load are modeled by sinusoidal functions
  • Keywords
    heat transfer; packaging; specific heat; temperature distribution; damping factor; delay factor; electronic equipment enclosure; heat flow; heat storage materials; internal temperature; latent-heat-storage mode; outside plant enclosures; phase change material; sensible-heat-storage mode; sinusoidal functions; solar load; thermal analog model; thermal capacitance; Capacitance; Delay estimation; Equations; Hazards; Material storage; Optical network units; Phase change materials; Protection; Telephony; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 1991. SEMI-THERM VII. Proceedings., Seventh Annual IEEE
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    0-87942-664-0
  • Type

    conf

  • DOI
    10.1109/STHERM.1991.152919
  • Filename
    152919