DocumentCode
235639
Title
A low-cost PCB fabrication process
Author
Ou, Jinping ; Maldonado, Andres ; Chio Saephan ; Farahmand, Farid ; Caggiano, Michael
Author_Institution
Eng. Sci., Sonoma State Univ., Rohnert Park, CA, USA
fYear
2014
fDate
27-30 May 2014
Firstpage
2159
Lastpage
2162
Abstract
This paper investigates the resolution of a low-cost printed circuit board (PCB) fabrication process. A set of frequently used footprints is fabricated on a PCB and examined under a digital microscope. The results indicate that using the process described in this paper, a thin wire with a 0.38 mm (14.96 mils) width can be fabricated. The process described in this paper is useful for educators who wish to fabricate a fine structure on a PCB, but do not have access to a milling machine. It is also be useful for researchers who wish to quickly build an inexpensive prototype before sending out the final design to a commercial venue.
Keywords
printed circuit manufacture; printed circuits; digital microscope; footprint; low-cost PCB fabrication process; milling machine; printed circuit board; size 0.38 mm; thin wire; Band-pass filters; Copper; Fabrication; Films; Geometry; Layout; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location
Orlando, FL
Type
conf
DOI
10.1109/ECTC.2014.6897601
Filename
6897601
Link To Document