• DocumentCode
    235639
  • Title

    A low-cost PCB fabrication process

  • Author

    Ou, Jinping ; Maldonado, Andres ; Chio Saephan ; Farahmand, Farid ; Caggiano, Michael

  • Author_Institution
    Eng. Sci., Sonoma State Univ., Rohnert Park, CA, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    2159
  • Lastpage
    2162
  • Abstract
    This paper investigates the resolution of a low-cost printed circuit board (PCB) fabrication process. A set of frequently used footprints is fabricated on a PCB and examined under a digital microscope. The results indicate that using the process described in this paper, a thin wire with a 0.38 mm (14.96 mils) width can be fabricated. The process described in this paper is useful for educators who wish to fabricate a fine structure on a PCB, but do not have access to a milling machine. It is also be useful for researchers who wish to quickly build an inexpensive prototype before sending out the final design to a commercial venue.
  • Keywords
    printed circuit manufacture; printed circuits; digital microscope; footprint; low-cost PCB fabrication process; milling machine; printed circuit board; size 0.38 mm; thin wire; Band-pass filters; Copper; Fabrication; Films; Geometry; Layout; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
  • Conference_Location
    Orlando, FL
  • Type

    conf

  • DOI
    10.1109/ECTC.2014.6897601
  • Filename
    6897601