Title :
Directed self-assembly of mesoscopic dies using magnetic force and shape recognition
Author :
Tkachenko, Aleksandr ; Karlicek, Robert F. ; Lu, James Jian-Qiang
Author_Institution :
NSF Smart Lighting Eng. Res. Center, Rensselaer Polytech. Inst., Troy, NY, USA
Abstract :
This paper reports on a directed self-assembly approach suitable for assembly of mesoscopic dies, such as LEDs, in a parallel fashion. This approach utilizes magnetic force, shape recognition, and capillary force of the solder to assemble the dies on the receiving substrate in a correct orientation. Assembly takes place in liquid medium. Effects of the die geometry, assembly setup and magnet configuration on the assembly results are presented along with the simulation of the solder-assisted self-alignment.
Keywords :
bonding processes; intermolecular forces; light emitting diodes; magnets; microassembling; nanotechnology; self-assembly; shape recognition; assembly setup; capillary force; die geometry; directed self-assembly; light emitting diode; liquid media; magnet configuration; magnetic force; mesoscopic die self-assembly; shape recognition; Assembly; Force; Light emitting diodes; Magnetic flux; Magnetic liquids; Substrates; Syntactics;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
DOI :
10.1109/ECTC.2014.6897609
