DocumentCode
235656
Title
Directed self-assembly of mesoscopic dies using magnetic force and shape recognition
Author
Tkachenko, Aleksandr ; Karlicek, Robert F. ; Lu, James Jian-Qiang
Author_Institution
NSF Smart Lighting Eng. Res. Center, Rensselaer Polytech. Inst., Troy, NY, USA
fYear
2014
fDate
27-30 May 2014
Firstpage
2207
Lastpage
2212
Abstract
This paper reports on a directed self-assembly approach suitable for assembly of mesoscopic dies, such as LEDs, in a parallel fashion. This approach utilizes magnetic force, shape recognition, and capillary force of the solder to assemble the dies on the receiving substrate in a correct orientation. Assembly takes place in liquid medium. Effects of the die geometry, assembly setup and magnet configuration on the assembly results are presented along with the simulation of the solder-assisted self-alignment.
Keywords
bonding processes; intermolecular forces; light emitting diodes; magnets; microassembling; nanotechnology; self-assembly; shape recognition; assembly setup; capillary force; die geometry; directed self-assembly; light emitting diode; liquid media; magnet configuration; magnetic force; mesoscopic die self-assembly; shape recognition; Assembly; Force; Light emitting diodes; Magnetic flux; Magnetic liquids; Substrates; Syntactics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location
Orlando, FL
Type
conf
DOI
10.1109/ECTC.2014.6897609
Filename
6897609
Link To Document