Title :
A design methodology for the minimum die area of power MOSFET´s considering thermal resistance of the package
Author :
Il-Jung Km ; Hwang, Seong-Kyu ; Choi, Yeam-Ik ; Han, Min-Koo
Author_Institution :
Seoul Nat´´l Univ.
Keywords :
Ambient intelligence; Design methodology; Electric resistance; Electronic packaging thermal management; Geometry; MOSFET circuits; Shape; Solid modeling; Temperature; Thermal resistance;
Conference_Titel :
Power Semiconductor Devices and ICs, 1992. ISPSD '92. Proceedings of the 4th International Symposium on
DOI :
10.1109/ISPSD.1992.991265
