Title :
Hydrogen peroxide concentration monitoring for CMP slurry
Author :
Nakai, Yoko ; Morimoto, Yuuki ; Takagi, Shinichi ; Mori, Yojiro
Author_Institution :
R&D Div., HORIBA, Ltd., Kyoto, Japan
Abstract :
CMP slurry contains abrasive and pH adjuster, and in many cases Hydrogen Peroxide (H2O2) is added as an oxidizer. In order to stabilize the process, H2O2 concentration is one of the critical factors, and Redox titration is generally used for H2O2 monitoring. However, titration method requires time, labor and consumables for sampling, pretreatment and titration itself with reagent, and it is not suitable for real-time monitoring. In this paper, the results of applying near infrared (NIR) and ultraviolet (UV) absorption spectroscopy and multivariate analysis for in-line H2O2 monitoring is reported.
Keywords :
chemical mechanical polishing; hydrogen compounds; oxidation; reduction (chemical); spectroscopy; CMP slurry; H2O2; NIR absorption spectroscopy; UV absorption spectroscopy; hydrogen peroxide concentration monitoring; multivariate analysis; near infrared absorption spectroscopy; pH adjuster; redox titration; titration method; ultraviolet absorption spectroscopy; Absorption; Calibration; Chemicals; Light scattering; Monitoring; Slurries; Wavelength measurement;
Conference_Titel :
Planarization/CMP Technology (ICPT), 2014 International Conference on
Conference_Location :
Kobe
Print_ISBN :
978-1-4799-5556-5
DOI :
10.1109/ICPT.2014.7017285