Hydrogen peroxide concentration monitoring for CMP slurry

Author

Nakai, Yoko ; Morimoto, Yuuki ; Takagi, Shinichi ; Mori, Yojiro

Author_Institution

R&D Div., HORIBA, Ltd., Kyoto, Japan

fYear

2014

fDate

19-21 Nov. 2014

Firstpage

225

Lastpage

228

Abstract

CMP slurry contains abrasive and pH adjuster, and in many cases Hydrogen Peroxide (H₂O₂) is added as an oxidizer. In order to stabilize the process, H₂O₂ concentration is one of the critical factors, and Redox titration is generally used for H₂O₂ monitoring. However, titration method requires time, labor and consumables for sampling, pretreatment and titration itself with reagent, and it is not suitable for real-time monitoring. In this paper, the results of applying near infrared (NIR) and ultraviolet (UV) absorption spectroscopy and multivariate analysis for in-line H₂O₂ monitoring is reported.

Keywords

chemical mechanical polishing; hydrogen compounds; oxidation; reduction (chemical); spectroscopy; CMP slurry; H₂O₂; NIR absorption spectroscopy; UV absorption spectroscopy; hydrogen peroxide concentration monitoring; multivariate analysis; near infrared absorption spectroscopy; pH adjuster; redox titration; titration method; ultraviolet absorption spectroscopy; Absorption; Calibration; Chemicals; Light scattering; Monitoring; Slurries; Wavelength measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Planarization/CMP Technology (ICPT), 2014 International Conference on

Conference_Location

Kobe

Print_ISBN

978-1-4799-5556-5

Type

conf

DOI

10.1109/ICPT.2014.7017285

Filename

7017285