DocumentCode :
235676
Title :
Modeling and analysis of frequency shift of MEMS gyroscope subjected to temperature change
Author :
Weihui Wang ; Sheng Liu ; Zhang Luo ; Ming Wen ; Qiang Dan ; Man Yu ; Yong Xu ; Xin Wu
Author_Institution :
Sch. of Mech. Sci. & Eng., Huazhong Univ. of Sci & Tech, Wuhan, China
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
2245
Lastpage :
2248
Abstract :
The mechanism of resonant frequency shift of MEMS gyroscope subjected to environment temperature change was investigated comprehensively in this paper, and its computational model was set up based on certain assumptions. Taking the structure of MEMS gyroscope as an example using the finite element method, firstly, the authors derived the simplified M-C-K dynamic model. Then, thermal stress and the thermal deformation of the model were calculated within temperature range from -40°Cto 120°C, and the regions of maximum value of thermal stress and thermal deformation were selected in the regions between anchors and driving spring beams. Finally, the analysis of modes was implemented under varying temperature ranging from -40°C to 120°C, and the relation between resonant frequency shift and temperature change was given at the reference temperature of 20°C. The results showed that the driving resonant frequency decreased while the resonant sensing frequency fluctuated in certain value when the environment temperature increased, which indicated that frequency shift was greatly dependent on thermal stress of the driving spring beams that suspended the driving comb structure.
Keywords :
deformation; finite element analysis; gyroscopes; micromechanical devices; thermal stresses; MEMS gyroscope; anchors; driving comb structure; driving spring beams; environment temperature change; finite element method; resonant frequency shift; resonant sensing frequency; simplified M-C-K dynamic model; temperature -40 degC to 120 degC; thermal deformation; thermal stress; Gyroscopes; Micromechanical devices; Resonant frequency; Stress; Temperature; Temperature sensors; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
Type :
conf
DOI :
10.1109/ECTC.2014.6897616
Filename :
6897616
Link To Document :
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