DocumentCode
2356782
Title
Thermal dissipation of ´chip on chip´ module
Author
Kodama, Kunio ; Akai, Takao ; Nizukoshi, M. ; Yamauchi, Tsunenori
Author_Institution
Fujitsu Co., Ltd.
fYear
1992
fDate
1992
Firstpage
246
Lastpage
247
Keywords
Assembly; Bonding; Conductive adhesives; Immune system; Modular construction; Multichip modules; Packaging; Power integrated circuits; Thermal conductivity; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs, 1992. ISPSD '92. Proceedings of the 4th International Symposium on
Type
conf
DOI
10.1109/ISPSD.1992.991278
Filename
991278
Link To Document