DocumentCode :
2356782
Title :
Thermal dissipation of ´chip on chip´ module
Author :
Kodama, Kunio ; Akai, Takao ; Nizukoshi, M. ; Yamauchi, Tsunenori
Author_Institution :
Fujitsu Co., Ltd.
fYear :
1992
fDate :
1992
Firstpage :
246
Lastpage :
247
Keywords :
Assembly; Bonding; Conductive adhesives; Immune system; Modular construction; Multichip modules; Packaging; Power integrated circuits; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 1992. ISPSD '92. Proceedings of the 4th International Symposium on
Type :
conf
DOI :
10.1109/ISPSD.1992.991278
Filename :
991278
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2356782
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