DocumentCode :
2356783
Title :
Thermal management of high performance microprocessors in burn-in environment
Author :
Vassighi, Arman ; Semenov, Oleg ; Sachdev, Manoj ; Keshavarzi, Ali
Author_Institution :
Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
fYear :
2003
fDate :
3-5 Nov. 2003
Firstpage :
313
Lastpage :
319
Abstract :
In deep sub-micron CMOS technologies, increased standby current in high performance processors results in increased junction temperature. This elevated temperature has a positive feedback on the standby current. If the temperature is not controlled, it may lead to thermal runaway. In this paper we investigate the thermal management of high performance chips in the burn-in environment.
Keywords :
CMOS integrated circuits; feedback; integrated circuit testing; leakage currents; microprocessor chips; thermal analysis; thermal stresses; CMOS; burn-in environment; burn-in ovens; high performance microprocessors; junction temperature estimation; junction temperature increase; junction to ambient thermal resistance; leakage current; standby current positive feedback; thermal management; thermal runaway; CMOS technology; Degradation; Environmental management; Leakage current; Microprocessors; Stress; Temperature; Thermal management; Thermal resistance; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Defect and Fault Tolerance in VLSI Systems, 2003. Proceedings. 18th IEEE International Symposium on
ISSN :
1550-5774
Print_ISBN :
0-7695-2042-1
Type :
conf
DOI :
10.1109/DFTVS.2003.1250126
Filename :
1250126
Link To Document :
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