DocumentCode
2356783
Title
Thermal management of high performance microprocessors in burn-in environment
Author
Vassighi, Arman ; Semenov, Oleg ; Sachdev, Manoj ; Keshavarzi, Ali
Author_Institution
Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
fYear
2003
fDate
3-5 Nov. 2003
Firstpage
313
Lastpage
319
Abstract
In deep sub-micron CMOS technologies, increased standby current in high performance processors results in increased junction temperature. This elevated temperature has a positive feedback on the standby current. If the temperature is not controlled, it may lead to thermal runaway. In this paper we investigate the thermal management of high performance chips in the burn-in environment.
Keywords
CMOS integrated circuits; feedback; integrated circuit testing; leakage currents; microprocessor chips; thermal analysis; thermal stresses; CMOS; burn-in environment; burn-in ovens; high performance microprocessors; junction temperature estimation; junction temperature increase; junction to ambient thermal resistance; leakage current; standby current positive feedback; thermal management; thermal runaway; CMOS technology; Degradation; Environmental management; Leakage current; Microprocessors; Stress; Temperature; Thermal management; Thermal resistance; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Defect and Fault Tolerance in VLSI Systems, 2003. Proceedings. 18th IEEE International Symposium on
ISSN
1550-5774
Print_ISBN
0-7695-2042-1
Type
conf
DOI
10.1109/DFTVS.2003.1250126
Filename
1250126
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