DocumentCode
235684
Title
Visualization of slurry flow in polishing pad asperity area
Author
Fukuda, Akira ; Mitarai, Masahito
Author_Institution
Nat. Inst. of Technol., Tokuyama Coll., Shunan, Japan
fYear
2014
fDate
19-21 Nov. 2014
Firstpage
234
Lastpage
236
Abstract
Various researchers have investigated the mechanism of chemical mechanical polishing (CMP). Although the slurry flow in a microscopic pad asperity is thought to play a critical role in the transport of abrasive particles to the wafer surface, this has not been completely explained. In this study, we devised a visualization method for the slurry flow in the pad asperity area, created an experimental apparatus for visualization, and attempted to obtain the flow velocity vector.
Keywords
abrasives; chemical mechanical polishing; flow visualisation; slurries; CMP; abrasive particles; chemical mechanical polishing; flow velocity vector; microscopic pad asperity; polishing pad asperity area; slurry flow; visualization; wafer surface; Abrasives; Data visualization; Planarization; Semiconductor device modeling; Slurries; Vectors; Visualization;
fLanguage
English
Publisher
ieee
Conference_Titel
Planarization/CMP Technology (ICPT), 2014 International Conference on
Conference_Location
Kobe
Print_ISBN
978-1-4799-5556-5
Type
conf
DOI
10.1109/ICPT.2014.7017288
Filename
7017288
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