Title :
Visualization of slurry flow in polishing pad asperity area
Author :
Fukuda, Akira ; Mitarai, Masahito
Author_Institution :
Nat. Inst. of Technol., Tokuyama Coll., Shunan, Japan
Abstract :
Various researchers have investigated the mechanism of chemical mechanical polishing (CMP). Although the slurry flow in a microscopic pad asperity is thought to play a critical role in the transport of abrasive particles to the wafer surface, this has not been completely explained. In this study, we devised a visualization method for the slurry flow in the pad asperity area, created an experimental apparatus for visualization, and attempted to obtain the flow velocity vector.
Keywords :
abrasives; chemical mechanical polishing; flow visualisation; slurries; CMP; abrasive particles; chemical mechanical polishing; flow velocity vector; microscopic pad asperity; polishing pad asperity area; slurry flow; visualization; wafer surface; Abrasives; Data visualization; Planarization; Semiconductor device modeling; Slurries; Vectors; Visualization;
Conference_Titel :
Planarization/CMP Technology (ICPT), 2014 International Conference on
Conference_Location :
Kobe
Print_ISBN :
978-1-4799-5556-5
DOI :
10.1109/ICPT.2014.7017288
