• DocumentCode
    2356942
  • Title

    Electrothermal circuit simulation of power ICs combining SPICE and 3D finite element analysis

  • Author

    Williams, Richard K. ; Rodamaker, Mark ; Sevilla, Larry T.

  • Author_Institution
    Siliconix, Inc.
  • fYear
    1992
  • fDate
    1992
  • Firstpage
    282
  • Lastpage
    287
  • Keywords
    Circuit simulation; Computational modeling; Electrothermal effects; Finite element methods; Isothermal processes; Power dissipation; Power integrated circuits; Predictive models; SPICE; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs, 1992. ISPSD '92. Proceedings of the 4th International Symposium on
  • Type

    conf

  • DOI
    10.1109/ISPSD.1992.991287
  • Filename
    991287
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2356942