DocumentCode :
2356942
Title :
Electrothermal circuit simulation of power ICs combining SPICE and 3D finite element analysis
Author :
Williams, Richard K. ; Rodamaker, Mark ; Sevilla, Larry T.
Author_Institution :
Siliconix, Inc.
fYear :
1992
fDate :
1992
Firstpage :
282
Lastpage :
287
Keywords :
Circuit simulation; Computational modeling; Electrothermal effects; Finite element methods; Isothermal processes; Power dissipation; Power integrated circuits; Predictive models; SPICE; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 1992. ISPSD '92. Proceedings of the 4th International Symposium on
Type :
conf
DOI :
10.1109/ISPSD.1992.991287
Filename :
991287
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2356942
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