• DocumentCode
    235696
  • Title

    Effects of pump-induced particle agglomeration during chemical mechanical planarization (CMP)

  • Author

    Young-Gil Seo ; Elaiyaraju, Periyasamy ; Jin-Goo Park

  • Author_Institution
    Dept. of Mater. Eng., Hanyang Univ., Ansan, South Korea
  • fYear
    2014
  • fDate
    19-21 Nov. 2014
  • Firstpage
    254
  • Lastpage
    258
  • Abstract
    In this study, the effects of large particle in chemical mechanical planarization (CMP) slurry were investigated on slurry distribution system, which utilizes a pumping device to circulate CMP slurry. Three different types of pumps (e.g., bellows, diaphragm and magnetically levitated centrifugal pump) were evaluated their performance such as generation of agglomerated particle and defectivity in different of slurries (Ceria slurry, Silica slurry a, Silica slurry b).
  • Keywords
    bellows; cerium compounds; chemical mechanical polishing; diaphragms; planarisation; pumps; silicon compounds; slurries; CMP slurry; CeO2; SiO2; centrifugal pump; ceria slurry; chemical mechanical planarization; pump-induced particle agglomeration; pumping device; silica slurry a; silica slurry b; slurry distribution system; Atmospheric measurements; Bellows; Particle measurements; Planarization; Silicon compounds; Slurries; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Planarization/CMP Technology (ICPT), 2014 International Conference on
  • Conference_Location
    Kobe
  • Print_ISBN
    978-1-4799-5556-5
  • Type

    conf

  • DOI
    10.1109/ICPT.2014.7017293
  • Filename
    7017293
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=235696