Title :
Cu corrosion in laminar flow using microfluidic channels
Author :
Abe, Makoto ; Takato, Chikako ; Hamada, Satomi ; Hayase, Masanori
Author_Institution :
Ebara Corp., Fujisawa, Japan
Abstract :
Increases in the sizes of silicon wafers and the degree of circuit integration has led to a requirement for a reduction in the size and number of defects, including defects caused by corrosion during the Cu-chemical mechanical polishing (CMP) or cleaning processes.
Keywords :
chemical analysis; copper; corrosion; laminar flow; microfluidics; silicon; CMP; Cu; chemical mechanical polishing; circuit integration; cleaning processes; corrosion; defects; laminar flow; microfluidic channels; wafer sizes; Copper; Corrosion; Grain boundaries; Microfluidics; Planarization; Rough surfaces; Surface roughness;
Conference_Titel :
Planarization/CMP Technology (ICPT), 2014 International Conference on
Conference_Location :
Kobe
Print_ISBN :
978-1-4799-5556-5
DOI :
10.1109/ICPT.2014.7017295
