DocumentCode
2357114
Title
Efficient test data decompression for system-on-a-chip using an embedded FPGA core
Author
Zeng, Gang ; Ito, Hideo
Author_Institution
Graduate Sch. of Sci. & Technol., Chiba Univ., Japan
fYear
2003
fDate
3-5 Nov. 2003
Firstpage
503
Lastpage
510
Abstract
In this paper, a novel compression/decompression test approach for system-on-a-chip (SoC) test using an embedded FPGA core is presented. The approach, employing Huffman coding, achieves test data volume and test application time reduction. The approach makes effective use of the embedded FPGA core such that the implementation is more efficient than that of the embedded processor-based approach. Due to the reconfigurable capability of FPGAs, the implementation of this approach has zero hardware overhead and higher flexibility in comparison with the general hardware-based implementation. Since the application with the FPGA has common problems of low speed and high power consumption, we demonstrate how to apply a CAM-based (content-addressable-memory) decompression architecture and low-power scan test vectors to overcome the difficulties. It is proven that the proposed approach is efficient from the experimental results.
Keywords
Huffman codes; automatic test pattern generation; boundary scan testing; content-addressable storage; data compression; field programmable gate arrays; logic design; logic testing; system-on-chip; ATPG; CAM-based decompression architecture; FPGA decoder; Huffman coding; SoC testing; content-addressable-memory; data compression; embedded FPGA core; lossless compression algorithms; low-power scan test vectors; scan testing; system-on-a-chip; test application time reduction; test data decompression; test data volume reduction; Application specific integrated circuits; Decoding; Energy consumption; Field programmable gate arrays; Hardware; Logic testing; Programmable logic arrays; Programmable logic devices; System testing; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Defect and Fault Tolerance in VLSI Systems, 2003. Proceedings. 18th IEEE International Symposium on
ISSN
1550-5774
Print_ISBN
0-7695-2042-1
Type
conf
DOI
10.1109/DFTVS.2003.1250149
Filename
1250149
Link To Document