• DocumentCode
    2357120
  • Title

    Thin film encapsulation by e-beam evaporation of oxides

  • Author

    Huang, Z.H.

  • Author_Institution
    Singapore Inst. of Manuf. Technol., Singapore, Singapore
  • fYear
    2010
  • fDate
    8-10 Dec. 2010
  • Firstpage
    23
  • Lastpage
    26
  • Abstract
    A few oxide thin films, SiO2, TiO2, Al2O3 and ZrO2 were deposited by e-beam evaporation and evaluated on their encapsulation performance. Ca buttons were used as sensors to detect the permeated oxygen and moisture through the oxide barrier layers. The metal Ca sensors coated by the barrier layers were microscopically observed. The results showed that the optimal single layer thickness was varied from 10 to 50 nm, depending on the oxide material. A thicker layer than 60 nm was not helpful for improvement of barrier performance, likely due to the existence of imperfects on substrate and the creation of cracks due to the large residual stress of the oxide thin films. As thin film encapsulation materials, e-beam evaporated Al2O3 and ZrO2 are superior to SiO2 and TiO2 in barrier performance.
  • Keywords
    aluminium compounds; calcium; cracks; oxygen; silicon compounds; thin film devices; titanium compounds; zirconium compounds; Al2O3; SiO2; TiO2; ZrO2; crack; e-beam evaporation; metal calcium sensor; oxide barrier layer; oxide material; oxide thin film; permeated oxygen detection; residual stress; size 10 nm to 50 nm; thin film encapsulation material;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2010 12th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-8560-4
  • Electronic_ISBN
    978-1-4244-8561-1
  • Type

    conf

  • DOI
    10.1109/EPTC.2010.5702599
  • Filename
    5702599