DocumentCode
2357120
Title
Thin film encapsulation by e-beam evaporation of oxides
Author
Huang, Z.H.
Author_Institution
Singapore Inst. of Manuf. Technol., Singapore, Singapore
fYear
2010
fDate
8-10 Dec. 2010
Firstpage
23
Lastpage
26
Abstract
A few oxide thin films, SiO2, TiO2, Al2O3 and ZrO2 were deposited by e-beam evaporation and evaluated on their encapsulation performance. Ca buttons were used as sensors to detect the permeated oxygen and moisture through the oxide barrier layers. The metal Ca sensors coated by the barrier layers were microscopically observed. The results showed that the optimal single layer thickness was varied from 10 to 50 nm, depending on the oxide material. A thicker layer than 60 nm was not helpful for improvement of barrier performance, likely due to the existence of imperfects on substrate and the creation of cracks due to the large residual stress of the oxide thin films. As thin film encapsulation materials, e-beam evaporated Al2O3 and ZrO2 are superior to SiO2 and TiO2 in barrier performance.
Keywords
aluminium compounds; calcium; cracks; oxygen; silicon compounds; thin film devices; titanium compounds; zirconium compounds; Al2O3; SiO2; TiO2; ZrO2; crack; e-beam evaporation; metal calcium sensor; oxide barrier layer; oxide material; oxide thin film; permeated oxygen detection; residual stress; size 10 nm to 50 nm; thin film encapsulation material;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location
Singapore
Print_ISBN
978-1-4244-8560-4
Electronic_ISBN
978-1-4244-8561-1
Type
conf
DOI
10.1109/EPTC.2010.5702599
Filename
5702599
Link To Document