Title :
3M microreplicated TrizactTM pad conditioners for FEOL tungsten plug and metal gate applications
Author :
Zabasajja, John ; Sokol, Jennifer ; Laraia, Vince ; Fritz, Matt ; Junqing Xie ; Gould, Chuck
Author_Institution :
Electron. Mater. Solutions Div., 3M Co., St. Paul, MN, USA
Abstract :
In this paper, a novel pad conditioner, 3MTM TrizactTM Pad Conditioner, B6-M990, consisting of precisely engineered microreplicated abrasive structures coated with a chemical vapor deposited (CVD) diamond film is demonstrated for Front End Of Line (FEOL) Tungsten plug and metal gate applications. Baseline marathon data of W plug and gate processes, comparing the Trizact™ Pad Conditioner to a diamond grit pad conditioner (DG) were generated on a 300 mm AMAT Reflexion® tool. In-situ and ex-situ conditioning processes showed that the pad/conditioner lifetime could be extended by at least a factor of 3 using B6-M990 Trizact™ Pad Conditioner versus the diamond grit conditioner while maintaining the same W and TEOS removal rates.
Keywords :
chemical vapour deposition; diamond; tungsten; 3M microreplicated TrizactTM pad conditioners; AMAT Reflexion tool; B6-M990; CVD; TEOS; W; chemical vapor deposition; diamond film; diamond grit conditioner; diamond grit pad conditioner; front end of line tungsten plug; metal gate; microreplicated abrasive structures; size 300 mm; Diamonds; Logic gates; Planarization; Slurries; Testing; Tungsten; TEOS; Tungsten; metal gate; microreplication;
Conference_Titel :
Planarization/CMP Technology (ICPT), 2014 International Conference on
Conference_Location :
Kobe
Print_ISBN :
978-1-4799-5556-5
DOI :
10.1109/ICPT.2014.7017307