A study on swing-arm conditioning for enhancing pad lifetime in CMP

Author

Hyunseop Lee ; Dasol Lee ; Haedo Jeong ; Sangjik Lee

Author_Institution

Dept. of Mech. Eng., Tongmyong Univ., Busan, South Korea

fYear

2014

fDate

19-21 Nov. 2014

Firstpage

348

Lastpage

351

Abstract

A swing-arm conditioning is generally adopted for chemical mechanical polishing (CMP) system to recover the surface roughness of polishing pad. However, the conditioning process results in uneven pad profile. During conditioning, locally excessive pad wear relates to the pad lifetime in CMP process. In this paper we investigate on the relationship of locally controlled swing condition and maximum pad wear during pad conditioning process.

Keywords

chemical mechanical polishing; surface roughness; CMP system; chemical mechanical polishing; locally controlled swing condition; maximum pad wear; pad conditioning process; pad lifetime enhancement; polishing pad; surface roughness; swing-arm conditioning process; Chemicals; Diamonds; Educational institutions; Materials; Planarization; Shape;

fLanguage

English

Publisher

ieee

Conference_Titel

Planarization/CMP Technology (ICPT), 2014 International Conference on

Conference_Location

Kobe

Print_ISBN

978-1-4799-5556-5

Type

conf

DOI

10.1109/ICPT.2014.7017317

Filename

7017317

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=235723