IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168)

fYear

1998

fDate

23-25 Sept. 1998

Abstract

The following topics were dealt with: yield modeling and analysis; overall equipment efficiency; yield enhancement strategies and techniques; harnessing and developing workforce potential; contamination free manufacturing; advanced metrology; cost reduction; photolithography and etching; interconnect technology; factory automation and WIP management; isolation and dielectric issues at 0.18 μm; factory modeling and simulation.

Keywords

dielectric thin films; etching; factory automation; integrated circuit economics; integrated circuit interconnections; integrated circuit manufacture; integrated circuit measurement; integrated circuit modelling; integrated circuit yield; isolation technology; personnel; photolithography; production engineering computing; surface contamination; WIP management; contamination free manufacturing; cost reduction; dielectric issues; equipment efficiency; etching; factory automation; factory modeling; factory simulation; interconnect technology; isolation; metrology; photolithography; semiconductor manufacturing; workforce potential; yield analysis; yield enhancement strategies; yield modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI

Conference_Location

Boston, MA, USA

ISSN

1078-8743

Print_ISBN

0-7803-4380-8

Type

conf

DOI

10.1109/ASMC.1998.731353

Filename

731353