DocumentCode
2357283
Title
Large area spray cooling by inclined nozzles for electronic board
Author
Yan, Z.B. ; Duan, F. ; Wong, T.N. ; Toh, K.C. ; Choo, K.F. ; Chan, P.K. ; Chua, Y.S. ; Lee, L.W.
Author_Institution
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear
2010
fDate
8-10 Dec. 2010
Firstpage
76
Lastpage
78
Abstract
To cool a 1 kW 6U electronic card, an innovative inclined spray chamber with multiple nozzles has been developed and investigated with a closed-loop refrigeration system. A large heated surface (12.3 × 15.5 cm2) was sprayed by four gas-assisted nozzles with an inclined angle of 39° relative to the normal direction. A reasonable spray coverage area can be obtained by the inclined spray chamber while enabling a relatively lower spray chamber height than that required by a normal spray chamber. R134a was implemented as the working fluid in this study. The mass flow rate, pressure drop across the nozzles, and the spray chamber pressure were varied experimentally, and the results suggest that the increases of the mass flow rate, the pressure drop across the nozzles, and the spray chamber pressure can improve the thermal performance of the inclined spray. The average heated surface temperature can be maintained within 20.0°C, and the maximum heat transfer coefficient of 4742.2 W/m2·K can be achieved at a suitable working condition.
Keywords
heat transfer; nozzles; refrigeration; spraying; thermal management (packaging); average heated surface temperature; closed-loop refrigeration system; electronic board; gas-assisted nozzles; inclined nozzles; innovative inclined spray chamber; large area spray cooling; power 1 kW;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location
Singapore
Print_ISBN
978-1-4244-8560-4
Electronic_ISBN
978-1-4244-8561-1
Type
conf
DOI
10.1109/EPTC.2010.5702609
Filename
5702609
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