• DocumentCode
    2357396
  • Title

    Crosstalk model with impedance discontinuity for high speed interconnects

  • Author

    Yew, Yee Huan ; Shi, Hong ; Tan, Siow Chek ; Wong, Siew Lean ; Wong, C.P.

  • Author_Institution
    Altera Corp. (M) Sdn Bhd, Bayan Lepas, Malaysia
  • fYear
    2010
  • fDate
    8-10 Dec. 2010
  • Firstpage
    103
  • Lastpage
    107
  • Abstract
    This paper presents a crosstalk model base on even-odd mode analysis. It demonstrates that crosstalk analysis needs to look at the aspect of the timing delay between even and odd mode and the multiple reflections that occurred in a system. This concept is validated further by measurement result.
  • Keywords
    crosstalk; delays; integrated circuit interconnections; integrated circuit packaging; crosstalk model; even-odd mode analysis; high speed interconnect; impedance discontinuity; multiple reflection; timing delay;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2010 12th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-8560-4
  • Electronic_ISBN
    978-1-4244-8561-1
  • Type

    conf

  • DOI
    10.1109/EPTC.2010.5702615
  • Filename
    5702615
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2357396