DocumentCode :
2357396
Title :
Crosstalk model with impedance discontinuity for high speed interconnects
Author :
Yew, Yee Huan ; Shi, Hong ; Tan, Siow Chek ; Wong, Siew Lean ; Wong, C.P.
Author_Institution :
Altera Corp. (M) Sdn Bhd, Bayan Lepas, Malaysia
fYear :
2010
fDate :
8-10 Dec. 2010
Firstpage :
103
Lastpage :
107
Abstract :
This paper presents a crosstalk model base on even-odd mode analysis. It demonstrates that crosstalk analysis needs to look at the aspect of the timing delay between even and odd mode and the multiple reflections that occurred in a system. This concept is validated further by measurement result.
Keywords :
crosstalk; delays; integrated circuit interconnections; integrated circuit packaging; crosstalk model; even-odd mode analysis; high speed interconnect; impedance discontinuity; multiple reflection; timing delay;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-8560-4
Electronic_ISBN :
978-1-4244-8561-1
Type :
conf
DOI :
10.1109/EPTC.2010.5702615
Filename :
5702615
Link To Document :
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