Title : 
Crosstalk model with impedance discontinuity for high speed interconnects
         
        
            Author : 
Yew, Yee Huan ; Shi, Hong ; Tan, Siow Chek ; Wong, Siew Lean ; Wong, C.P.
         
        
            Author_Institution : 
Altera Corp. (M) Sdn Bhd, Bayan Lepas, Malaysia
         
        
        
        
        
        
            Abstract : 
This paper presents a crosstalk model base on even-odd mode analysis. It demonstrates that crosstalk analysis needs to look at the aspect of the timing delay between even and odd mode and the multiple reflections that occurred in a system. This concept is validated further by measurement result.
         
        
            Keywords : 
crosstalk; delays; integrated circuit interconnections; integrated circuit packaging; crosstalk model; even-odd mode analysis; high speed interconnect; impedance discontinuity; multiple reflection; timing delay;
         
        
        
        
            Conference_Titel : 
Electronics Packaging Technology Conference (EPTC), 2010 12th
         
        
            Conference_Location : 
Singapore
         
        
            Print_ISBN : 
978-1-4244-8560-4
         
        
            Electronic_ISBN : 
978-1-4244-8561-1
         
        
        
            DOI : 
10.1109/EPTC.2010.5702615