Title :
Crosstalk model with impedance discontinuity for high speed interconnects
Author :
Yew, Yee Huan ; Shi, Hong ; Tan, Siow Chek ; Wong, Siew Lean ; Wong, C.P.
Author_Institution :
Altera Corp. (M) Sdn Bhd, Bayan Lepas, Malaysia
Abstract :
This paper presents a crosstalk model base on even-odd mode analysis. It demonstrates that crosstalk analysis needs to look at the aspect of the timing delay between even and odd mode and the multiple reflections that occurred in a system. This concept is validated further by measurement result.
Keywords :
crosstalk; delays; integrated circuit interconnections; integrated circuit packaging; crosstalk model; even-odd mode analysis; high speed interconnect; impedance discontinuity; multiple reflection; timing delay;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-8560-4
Electronic_ISBN :
978-1-4244-8561-1
DOI :
10.1109/EPTC.2010.5702615